FLIP CHIP・DIE BONDER

YHP-2 Hybrid placer (advanced flip chip & die bonder)

• Capable of mixed mounting of SMD components and semi-conductor components
  
• Capable of handling multiple types of the dipping unit
  
• Usable for dipping &stamping by the dipping unit
  
• Applicable for a wide area up to L300mm x W200mm

YHP-2D